Electrothermal Analysis of CVD-Grown hBN Heat Spreader using Pt/Cu/Ti Micro-Coil

This article presents the electrothermal analysis of hexagonal boron nitride (hBN) grown by chemical vapor deposition (CVD) as a two-dimensional insulator heat spreader. The thickness and indirect bandgap hBN are 11.5 ± 0.8 nm 5.85 0.04 eV, respectively. fabricated Pt/Cu/Ti (30/500/20 nm) micro-coil served source sensitive resistance thermometer, with temperature coefficient higher than 0.0066 K−1. For bare structure, default spreader is SiO2 lateral thermal resistance, ΘSiO2 around 5.0–5.2 KW−1. It provides cooling coil up to −0.4 CVD-grown reference graphene oxide (GO) on coils modified network devices. || ΘhBN 3.520 KW−1 −1.694 KW−1, while ΘGO 3.765 −1.556 Compared device, 4.78 times normalized hotspot cooling, GO 4.01 that device. Multilayer suitable for direct-contact spreader, since it improves spreading from without short-circuiting coil.